[AISWorld] Extended Deadline - February 7, 2018: IEEE International Conference on Cloud Computing (IEEE CLOUD 2018)

[Patrick Hung]

Deadline Extended! The new deadline for regular papers is *****February 7, 2018*****.



***** Call For Papers *****

IEEE International Conference on Cloud Computing (IEEE CLOUD 2018)
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2018 IEEE World Congress on Services
JULY 2 - 7, 2018, SAN FRANCISCO, USA

Website: http://conferences.computer.org/cloud/2018/


IEEE CLOUD is the flagship conference focusing on Innovative cloud computing across all the "as a service" categories (such as Networks, Infrastructure, Platform, Software, and Function).

The IEEE CLOUD 2018 is solely sponsored by the IEEE Computer Society under the auspice of the Technical Committee on Services Computing (TCSVC).

Contributions addressing all areas related to cloud computing technology, systems, applications and business innovations are solicited. CLOUD 2018 will organize refereed paper reviews in 11 research areas (themes):

Cloud as a Service
* Infrastructure as a service (IaaS)
* Platform as a service (PaaS) and Cloud Foundry
* Software as a service (SaaS)
* Storage as a service
* Network as a service
* Information as a service

Cloud Infrastructure
* Cloud Computing Architectures
* Storage and Data Architectures
* Distributed and Cloud Networking
* Infrastructure Technologies
* Public, Private, and Hybrid Clouds

Cloud Management and Operations
* Cloud Composition, Federation, Bridging, and Bursting
* Cloud Migration
* Hybrid Cloud Integration
* Compliance Management in Cloud
* Green and Energy Management of Cloud Computing
* Cloud Configuration and Capacity Management
* Cloud Workload Profiling and Deployment Control
* Self-service Cloud Portal, Dashboard, and Analytics
* Cloud Metering and Monitoring
* Service Management Automation

Cloud Security
* Cloud Security
* Data Privacy
* Cloud Privacy
* Security as a service

Blockchain
* Blockchain Platforms
* Blockchain Mechanisms
* Enterprise Blockchain Solutions and Applications

Performance, Scalability, and Reliability
* Performance of Cloud Systems and Applications
* Cloud Availability and Reliability
* Microservices-based Architecture

Systems Software and Hardware
* Virtualization and Composition
* Cloud Provisioning Orchestration
* Architecture Support for Cloud Computing, including ASICs and FPGAs

Data Analytics in Cloud
* Analytics Applications
* Scientific Computing and Data Management
* Big data Management and Analytics
* Storage, Data, and Analytics Clouds

Software Engineering Practice for Cloud
* Cloud Solution Design Patterns
* Cloud Programming Models
* Cloud Development Tools
* Service Life Cycle Management
* Autonomic Business Process and Workflow Management in Clouds
* Cloud Modeling
* Research on Cloud Software
* User Experience Design

Cloud Applications
* Large Scale Cloud Application
* Innovative Cloud Applications and Experiences
* Social and Mobile Clouds
* Mobile Services

Cloud Economics
* Cloud Strategy for Enterprise Business Transformation
* Cloud Service Level Agreements (SLAs)
* Economic and Business Model of Clouds and Cloud Services
* ROI Analysis
* Cloud Quality Management
* Cloud Computing Consulting
* Cloud Cost and Pricing


*** Manuscript Guidelines and Submission Information ***
Language: English.
Paper size and format: US Letter; Two-column format in the IEEE style.
Page limit: Up to 8 pages for peer review.
Abstract length:  Approximately 1500 characters.
File format: Limit the size of a single PDF file to be 6 MB.

All submitted manuscripts will be peer-reviewed by at least 3 program committee members. Accepted papers with confirmed presentation will appear in the conference proceedings published by the IEEE Computer Society Press. Each conference/congress will publicly announce the winners of its Best Paper Award, and Best Student Paper Award. The authors of selected papers will be encouraged to submit extended and enhanced versions of their papers to the IEEE Transactions on Services Computing (TSC) and other suitable journals.

*** Key Dates ***
Paper submission (for peer review) due: February 7, 2018 (Extended Deadline).
Notification to authors on the decisions on papers: March 22, 2018.
Camera-ready papers due: April 6, 2018.
Congress date: July 2 – 7, 2018.

General Chair: Geoffrey Fox, Indiana University, USA
General Co-Chair: Daniel Reed, University of Iowa, USA
Program Chair: Ian Foster, Argonne National Lab and University of Chicago, USA
Program Co-Chair: Jia Zhang, Carnegie Mellon University, USA

Program Committee Members:

Gail-Joon Ahn, Arizona State University, USA
Kento Aida, National Institute of Informatics, Japan
Marco Aiello, University of Groningen, The Netherlands
Jorn Altmann, Seoul National University, South Korea
Gabriel Antoniu, INRIA, France
Amy Apon, Clemson University, USA
Danilo Ardagna, Politecnico di Milano, Italy
Janaka Balasooriya, Arizona State University, USA
Bharath Balasubramanian, AT&T Labs Research, USA
Karin Becker, UFRGS, Brazil
Elisa Bertino, Purdue University, USA
Ken Birman, Cornell University, USA
Ivona Brandic, Vienna University of Technology, Austria
Mauricio Breternitz, AMD Research, USA
Kris Bubendorfer, Victoria University of Wellington, New Zealand
Rajkumar Buyya, The University of Melbourne, Australia
Claris Castillo, UNC Chapel Hill, USA
Ee-Chien Chang, National University of Singapore
Kyle Chard, University of Chicago and Argonne National Lab, USA
Giorgos Cheliotis, National University of Singapore
Feng Chen, Louisiana State University, USA
Haopeng Chen, Shanghai Jiao Tong University, China
Keke Chen, Wright State University, USA
Songqing Chen, George Mason University, USA
Yong Chen, Texas Tech University, USA
Malolan Chetlur, IBM India Research Lab
Gregory Chockler, University of London, UK
Charles Consel, Inria / Bordeaux Institute of Technology, France
Stephen Crago, USC/ISI, USA
Bruno Crispo, University of Trento, Italy
Alfredo Cuzzocrea, ICAR-CNR and University of Calabria, Italy
Shuiguang Deng, Zhejiang University, China
Schahram Dustdar, Vienna University of Technology, Austria
Robert Van Engelen, Florida State University, USA
David Eyers, University of Otago, New Zealand
Thomas Fahringer, University of Innsbruck, Austria
Elena Ferrari, University of Insubria, Italy
João Eduardo Ferreira, University of São Paulo, Brazil
Dennis Gannon, Indiana University, USA
Debin Gao, Singapore Management University
Chris Gniady, University of Arizona, USA
Andrzej Goscinski, Deakin University, Australia
Kannan Govindarajan, Indiana University, USA
Madhu Govindaraju, State University of New York - Binghamton, USA
Paul Grefen, Eindhoven University of Technology, The Netherlands
Daniel Grosu, Wayne State University, USA
Mike Goul, Arizona State University, USA
Mohammad Hamdaqa, University of Waterloo, Canada
Yuxiong He, Microsoft, USA
Robert Hsu, Chung Hua University, Taiwan
H. Howie Huang, George Washington University, USA
Sheng Huang, IBM China Research
Waldemar Hummer, IBM Research, USA
Marty Humphrey, University of Virginia, USA
Adriana Iamnitchi, University of South Florida, USA
Praveen Jayachandran, IBM Research India
Deepal Jayasinghe, Geogia Tech, USA
Hai Jin, Huazhong University of Science and Technology, China
Anupam Joshi, University of Maryland Baltimore County, USA
Gueyoung Jung, AT&T Labs, USA
Vana Kalogeraki, Athens University of Economics and Business, Greece
Naga Kandasamy, Drexel University, USA
Yasuhiko Kanemasa, Fujitsu Laboratories Ltd., Japan
Jacek Kitowski, Inst. Comput. Sci. AGH-UST & CYFRONET AGH, Poland
Hsien-Ju Ko, Asia University, Taiwan
Alexander Konstantinou, Google, USA
Chandra Krintz, University of California, Santa Barbara, USA
Diwakar Krishnamurthy, University of Calgary, Canada
Ram Krishnan, University of Texas at San Antonio, USA
Ashish Kundu, IBM, USA
Philipp Leitner, Chalmers University of Technology and University of Gothenburg, Sweden
Marin Litoiu, University of York, UK
Xumin Liu, Rochester Institute of Technology, USA
Ignacio Llorente, Complutense University, Spain, and Harvard University, USA
Hui Lu, Binghamton University, USA
Lei Lu, VMware, USA
Shiyong Lu, Wayne State University, USA
Heiko Ludwig, IBM, USA
Brahim Medjahed, University of Michigan, Dearborn, USA
Sameep Mehta, IBM India Research Lab
Fanjing Meng, IBM China Research Lab
Ningfang Mi, Northeastern University, USA
Ajay Mohindra, IBM, USA
Kwang Mong Sim, University of Kent, UK
Ramses Morales, VMware, USA
Klara Nahrstedt, University of Illinois - Urbana-Champaign, USA
Leandro Navarro, Universitat Politècnica de Catalunya, Spain
Dirk Neumann, Albert-Ludwigs-Universität Freiburg, Germany
Talal H. Noor, Taibah University, Saudi Arabia
Seog-Chan Oh, General Motors R&D, USA
Sanjay Patel, LDRP-ITR, India
Bo Peng, Indiana University, USA
Roberto Di Pietro, Bell Labs, Italy
Judy Qiu, Indiana University Bloomington, USA
Ioan Raicu, Illinois Institute of Technology, USA
Omer Rana, Cardiff University, UK
Ajith Ranabahu, Amazon, USA
Kui Ren, State University of New York at Buffalo, USA
Shaolei Ren, University of California - Riverside, USA
Norbert Ritter, University of Hamburg, Germany
Rizos Sakellariou, The University of Manchester, UK
Iman Saleh, Intel, USA
Benjamin Satzger, Microsoft, USA
Upendra Sharma, IBM, USA
Jun Shen, University of Wollongong, USA
Michael Sheng, Macquarie University
Yasushi Shinjo, University of Tsukuba, Japan
Marcio Silva, IBM, USA
Ignacio Silva-Lepe, IBM, USA
Aleksander Slominski, IBM
Evgenia Smirni, College of William and Mary, USA
Craig Stewart, Indiana University, USA
Toyotaro Suzumura, IBM, USA
Hassan Takabi, University of North Texas, USA
Ladan Tahvildari, University of Waterloo, Canada
Yuzhe Tang, Syracuse University, USA
Douglas Thain, University of Notre Dame, USA
Luis Vaquero, University of Bristol, UK
Gregor von Laszewski, Indiana University Bloomington, USA
Chengwei Wang, AT&T Labs Research, USA
Liqiang Wang, University of Central Florida, USA
Rich Wolski, University of California Santa Barbara, USA
Raymond Wong, The University of New South Wales, Australia
Yuni Xia, IUPUI, USA
Cheng-Zhong Xu, Wayne State University, USA
I-Ling Yen, University of Texas Dallas, USA
Qi Yu, Rochester Institute of Technology, USA
Ming Zhao, Arizona State University, USA
Nianjun Zhou, IBM T.J. Watson Research, USA
Xiaobo Zhou, University of Colorado, Colorado Springs, USA
Wolf Zimmermann, Martin Luther University Halle-Wittenberg, Germany


If you have any questions or queries on IEEE CLOUD 2018, please send email to: ieeecs DOT cloud AT gmail DOT com.

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