[AISWorld] CFP: special issue-Electronic Commerce in the Asia-Pacific

[Jian]

Electronic Commerce Research-Springer (2017 impact factor 1.489)

 

Electronic commerce in the Asia-Pacific has developed rapidly over the past
20 years.  The Asia-Pacific Region now hosts many of the world's largest
e-commerce platforms, including Alibaba, Taobao and JD.com.  The region is
also reinventing business models and innovating in e-commerce through
competitors such as Meituan, Pinduoduo and Tencent.  It has become a major
player in electronic payments technologies with Ant Financial, WeChat Wallet
and Alipay. Softbank and Alibaba investments are funding innovation in many
new technologies outside of Silicon Valley.  

 

E-commerce players in the Asia-Pacific Region face challenges - they must
address many more cultures, logistics challenges and buyer preferences than
their Western counterparts.  In facing these challenges, they have innovated
their path to success in ways that prepare them to enter nearly any market
in the world.  They have accumulated Global data repositories that provide
them a unique competitive advantage in competing in global markets.   They
have pro-actively innovated in mobile commerce, social commerce and
cross-border e-commerce. 

 

Our special issue seeks the submission of high-quality papers on topics
addressing the many substantial challenges to e-commerce in the Pacific Asia
Region. We have listed a number of potential research topics.  Submissions
are not limited to this list, and we invite high quality, innovative and
novel investigations of all e-commerce topics concerning the Asia-Pacific.

 

Editors.  This special issue will be co-edited by:  

*         Jian Mou (jian.mou at xidian.edu.cn), Xidian University

!$         TaeHo Hong (taeho.hong at gmail.com), Pusan National University

!$         Chul Ho Lee (irontigerlee at gmail.com), KAIST 


Topics. The special issue will be devoted to the exploration of strategic,
managerial, organizational, technical, security, privacy and policy
challenges with regard to information services under e-commerce. We seek
high-quality, unpublished contributions addressing electronic commerce on
the following and related topics:

!$         Success factors in e-commerce 

!$         Policy issues e-commerce regulation

!$         Consumer reviews and recommendation systems

!$         Mobile technologies 

!$         Logistics challenges 

!$         Big data, machine learning and cloud platforms

!$         Communication and collaboration ib platforms

!$         Economic and business innovation 

!$         Trust, privacy and security issues 

*         Service and e-commerce

*         Localization based service and e-commerce

*         Cross-cultural issues in e-commerce

*         Emerging issues in e-commerce under Pacific Asia.

 

Submission Deadline. The submission deadline for full papers is November 1,
2019. Authors are encouraged to submit as soon as possible.  Authors may
find the submission link form Electronic Commerce Research official website,
or click   <https://www.editorialmanager.com/elec/default.aspx>
https://www.editorialmanager.com/elec/default.aspx.

The authors should click Submit New Manuscript in the submission system, and
then in Select Article Type, you should choose S.I.: Electronic Commerce in
the Asia-Pacific to start your submission. 

Review Process. The special issue editors will return first reviews and AE
reports no later than 60 days from the date of submission. We will use a
developmental reviewing approach for this special issue, with the aim of
helping special issue authors to achieve very high quality final
publications. Second and third round reviews, as needed, will be completed
on an expedited basis, if authors are able to turn their revisions around
quickly. We also will provide special issue authors with an indication as
early as possible of rejection for the special issue, including decisions
based on a first reading by the special issue editors. Inappropriately
targeted or under-developed papers will be returned immediately to the
authors.

Publication Date: TBD 

For Authors:  Interested authors should feel free to direct questions to the
special issue editors.

 

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