<br><font size=2 face="sans-serif">CALL FOR CHAPTER PROPOSALS</font><font size=3>
</font><font size=2 face="sans-serif"><br>
Proposal Submission Deadline: Jan 15, 2013</font><font size=3> </font><font size=2 face="sans-serif"><br>
Smart Manufacturing Innovation and Transformation: Interconnection and
Intelligence</font><font size=3> </font><font size=2 face="sans-serif"><br>
A book edited by Dr. Zongwei Luo (University of Hong Kong, Hong Kong, China)</font><font size=3>
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To be published by IGI Global: </font><font size=2 color=#808080>http://</font><font size=2>www.igi-global.com</font><font size=2 color=#808080>/publish/call-for-papers/call-details/870</font><font size=3><br>
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Introduction</font><font size=3> </font><font size=2 face="sans-serif"><br>
Fast advances in information technology (RFID, sensor, Internet of things,
and the Cloud) have led to a smarter world vision with ubiquitous interconnection
and intelligence. Smart manufacturing refers to advanced manufacturing
with wise adoption of information technologies throughout end to end product
and service life-cycles, capturing manufacturing intelligence for wise
production and services. Smart manufacturing represents a field with intense
competition in this century of national competitiveness.</font><font size=3>
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Objective of the Book</font><font size=3> </font><font size=2 face="sans-serif"><br>
This book will provide a forum of innovative findings in advanced manufacturing
research and development. It aims to promote an international knowledge
exchange community involving multidisciplinary participation from researchers,
practitioners, and academicians with insight addressing issues in real
life problems towards smarter manufacturing. By disseminating latest developments
in smart manufacturing innovation and transformation in manufacturing upon
current and/or emerging technology opportunities and market imperatives,
this book covers both theoretical perspectives and practical approaches
for smart manufacturing research and development triggered by ubiquitous
interconnection and intelligence, enabling manufacturing innovation and
transformation.</font><font size=3> <br>
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Target audience</font><font size=3> </font><font size=2 face="sans-serif"><br>
This book will provide a forum of innovative findings in advanced manufacturing
research and development. It aims to promote an international knowledge
exchange community involving multidisciplinary participation from researchers,
practitioners, and academicians with insight addressing issues in real
life problems towards smarter manufacturing. The target audience would
include multidisciplinary participants from society, industry, academia,
and government.</font><font size=3> <br>
</font><font size=2 face="sans-serif"><br>
Recommended topics include, but are not limited to, the following:</font><font size=3>
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* Business models and mechanism design</font><font size=3> </font><font size=2 face="sans-serif"><br>
* Big data computing and intelligence</font><font size=3> </font><font size=2 face="sans-serif"><br>
* Transparent and service computing</font><font size=3> </font><font size=2 face="sans-serif"><br>
* Social and human centric computing</font><font size=3> </font><font size=2 face="sans-serif"><br>
* Robotics and automation</font><font size=3> </font><font size=2 face="sans-serif"><br>
* SCM/Logistics for advanced manufacturing</font><font size=3> </font><font size=2 face="sans-serif"><br>
* MEMS/Hybrid systems for advanced manufacturing</font><font size=3> </font><font size=2 face="sans-serif"><br>
* E-commerce for advanced manufacturing</font><font size=3> </font><font size=2 face="sans-serif"><br>
* Manufacturing intelligence</font><font size=3> </font><font size=2 face="sans-serif"><br>
* Manufacturing sustainability</font><font size=3> </font><font size=2 face="sans-serif"><br>
* Digital and additive manufacturing</font><font size=3> </font><font size=2 face="sans-serif"><br>
* RFID/Internet of Things and cloud computing</font><font size=3> </font><font size=2 face="sans-serif"><br>
* CAD/CAM/CAE/CAPP</font><font size=3> </font><font size=2 face="sans-serif"><br>
* PLM/ERP/CRM</font><font size=3> </font><font size=2 face="sans-serif"><br>
* Structural health monitoring</font><font size=3> <br>
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Submission Procedure</font><font size=3> </font><font size=2 face="sans-serif"><br>
Researchers and practitioners are invited to submit on or before January
15, 2013, a 2-3 page chapter proposal clearly explaining the mission and
concerns of his or her proposed chapter. Authors of accepted proposals
will be notified by February 15, 2013 about the status of their proposals
and sent chapter guidelines. Full chapters are expected to be submitted
by April 15, 2013. All submitted chapters will be reviewed on a double-blind
review basis. Contributors may also be requested to serve as reviewers
for this project.</font><font size=3> <br>
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Publisher</font><font size=3> </font><font size=2 face="sans-serif"><br>
This book is scheduled to be published by IGI Global (formerly Idea Group
Inc.), publisher of the Information Science Reference (formerly Idea Group
Reference), Medical Information Science Reference, Business Science Reference,
and Engineering Science Reference imprints. For additional information
regarding the publisher, please visit www.igi-global.com. This book is
anticipated to be released in 2014.</font><font size=3> <br>
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Important Dates</font><font size=3> </font><font size=2 face="sans-serif"><br>
January 15, 2013: Proposal
Submission Deadline</font><font size=3> </font><font size=2 face="sans-serif"><br>
February 15, 2013: Notification
of Acceptance</font><font size=3> </font><font size=2 face="sans-serif"><br>
May 15, 2013: Full
Chapter Submission</font><font size=3> </font><font size=2 face="sans-serif"><br>
June 30, 2013: Review
Results Returned</font><font size=3> </font><font size=2 face="sans-serif"><br>
August 15, 2013: Final
Chapter Submission</font><font size=3> </font><font size=2 face="sans-serif"><br>
September 15, 2013: Final
Deadline</font><font size=3> </font><font size=2 face="sans-serif"><br>
</font><font size=3> </font><font size=2 face="sans-serif"><br>
Inquiries and submissions can be forwarded electronically (Word document)
or by mail to the Editor: <br>
Zongwei Luo</font><font size=3> </font><font size=2 face="sans-serif"><br>
E-mail: <br>
zwluo@eti.hku.hk</font><font size=3> </font><font size=2 face="sans-serif"><br>
Land mail: <br>
University of Hong Kong</font><font size=3> </font><font size=2 face="sans-serif"><br>
Level 3, Block A, Cyberport 4, 100 Cyberport Road, Hong Kong</font>