[AISWorld] CFP - Electronic Commerce in the Artificial Intelligence Era - ECRA (Impact Factor 6.014)

danjongkim at gmail.com danjongkim at gmail.com
Wed Nov 17 22:24:54 EST 2021


Dear Colleague,

The submission system is open for the ECRA SI of "Electronic Commerce in the
AI Era."

Special Issue on: Electronic Commerce in the Artificial Intelligence Era -
Call for papers - Electronic Commerce Research and Applications - Journal -
Elsevier
<https://www.journals.elsevier.com/electronic-commerce-research-and-applicat
ions/call-for-papers/special-issue-on-electronic-commerce-in-the-artificial-
intelligence-era> 

 

The Impact Factor of this journal (ECRA) is 6.014, ranking it 15 out of 112
in the areas of Information and Computer Science, Interdisciplinary
Applications. 

Please consider submitting your article related to AI applications.

Best

 

Dan J. Kim, Ph.D.

Fulbright Sr. Scholar & Professor of Information Technology & Decision
Sciences

G. Brint Ryan College of Business

University of North Texas

Email: dan.kim at unt.edu <mailto:dan.kim at unt.edu> 

Phone: 940.369.8942

Fax: 940.565.3803

 

Electronic Commerce Research and Application (ECRA)

CALL FOR PAPERS

Special Issue on:
Electronic Commerce in the Artificial Intelligence Era

Recent advancements of artificial intelligence (AI) have been transforming
the electronic commerce (eCommerce) industry. Using AI, eCommerce businesses
not only operate workflow automation through robotic process automation but
also understand their customers better and offer relevant products at the
right time. There are many examples and use cases. For example, Chatbots and
other eCommerce virtual assistants with voice-based interactions could
effectively respond to their inquiries and provide customer support. By
using AI capabilities such as self-learning algorithms and natural language
processing (NLP), they are enhancing the impact of AI in eCommerce. AI
personalization in eCommerce marketing can also enable eCommerce firms to
analyze customers' behavior and make precision recommendations for their
customers. Another prominent AI use-case area is electronic financial
service including mobile payment, credit system, and financial service using
AI innovation. For example, Ant Financial, one of the largest global FinTech
financial institutions in the world, has built up successful personal credit
and financial services using AI-powered applications. Although we expect AI
would be more impactful in eCommerce in the future, we also face the
challenges brought by applying AI technologies. The challenges include
ethical applications of advanced AI, governance, regulation, compliance,
safety, and privacy. 

This special issue calls for original high-quality papers addressing broad
areas of eCommerce challenges and issues in AI era to provide technical,
managerial, and policy implications. Topics of interest include, but are not
limited to the following:    

-          Chatbots and voice assistants in eCommerce transaction and
customer service

-          Personalization in marketing and sales using AI 

-          AI-based smart supply chain management

-          AI-based financial technology 

-          AI for risk control and management in eCommerce

-          Fake information and social manipulation

-          AI ethics, and policy and governance issues

-          Safety, privacy, personal information protection issues in AI
applications

-          Application of Blockchain technology in eCommerce

-          Localization based service in eCommerce

-          Cross-cultural issues in eCommerce

-          Emerging issues in e-commerce under Pacific Asia.

-          Academia-industry collaboration issues in AI

-          Theory buildings in AI studies

Important Dates 

Open submission: September 1, 2021

Submission due: March 31, 2022 

1st Round notification: June 30, 2022

Revision submission: September 30, 2022

2nd Round notification: December 31, 2022

Final version submission: March 31, 2023

The publication of Special Issue papers occurs as soon as possible after
their completion using a method called 'Article-Based Publication' (ABP).
This ensures the rapid publication of individual papers. Our experience
suggests that acceptance occurs between 6 to 12 months after a paper's
initial submission, and if it is accepted, it will reach publication in just
a month. Authors are encouraged to submit their papers as early as possible
to accelerate the review process. For further enquiries, please contact the
Managing Guest Editor.

Reviewing Process

Submissions are not batched for reviewing, but instead will be handled under
review as they are received. ECRA's Guest Editors (GE) or Senior Editors
(SE) will assist with the reviewing process. The editors will aim at
returning first reviews to authors no later than 90 days from the date of
submission. ECRA adopts a developmental reviewing approach for Special
Issues, to help authors to achieve high-quality final publications. Second
and third round reviews, as needed, will be completed on an expedited basis,
if authors can turn in their revisions quickly. Authors will be given an
indication as early as possible of rejection for the Special Issue, based on
the first reading by the Special Issue Editors. Inappropriately targeted or
under-developed papers will be returned immediately with feedback.

Submission Guidelines

All papers should be submitted via ECRA's submission system at
<http://www.ees.elsevier.com/ecra/> www.ees.elsevier.com/ecra/. Authors
should follow Elsevier's manuscript format, which can be found on the
journal's homepage at
<https://www.journals.elsevier.com/electronic-commerce-research-and-applicat
ions/>
https://www.journals.elsevier.com/electronic-commerce-research-and-applicati
ons/. 

 

Guest Editors

Managing guest editor: Yun Xu, Southwestern University of Finance and
Economics, China,  <mailto:xuyun at swufe.edu.cn> xuyun at swufe.edu.cn

Taekyung Kim, Kwangwoon university, South Korea,
<mailto:kimtk at office.kw.ac.kr> kimtk at office.kw.ac.kr

Xusen Cheng, Renmin University of China,  <mailto:xusen.cheng at ruc.edu.cn>
xusen.cheng at ruc.edu.cn

Dan J. Kim, University of North Texas, USA,  <mailto:Dan.Kim at unt.edu>
Dan.Kim at unt.edu

 

 

 

 




More information about the AISWorld mailing list