[AISWorld] Call for Applications: 2023 KrAIS Summer Workshop Doctoral Consortium

Dongwon LEE dongwon at ust.hk
Thu Mar 2 23:24:50 EST 2023


Call for Applications

2023 KrAIS Summer Workshop Doctoral Consortium

Korea University, Seoul, Korea, July 5, 2023


We are pleased to announce the 2023 KrAIS Doctoral Consortium as a pre-workshop event at the 2023 KrAIS Summer Workshop. The Doctoral Consortium will be held on July 5, 2023 in Seoul, Korea. The consortium will provide a platform for Korean doctoral students to meet other peers in the field of information systems and get to know different research topics and current trends. It will also offer an opportunity to discuss academic career development and academic life with an esteemed group of early-career, mid-career, and senior faculty members. While doctoral candidates who are preparing their dissertations are highly encouraged to apply, all interested PhD students and recent post-docs working in the information systems and related fields are invited to apply. There is no additional cost to attend the Doctoral Consortium, but participants must register for the main workshop on July 6-7, 2023.
IMPORTANT DATES
Doctoral Consortium Application Deadline: April 10, 2023, 11:59 PM (Time zone: Seoul, Korea)
Doctoral Consortium Notification: May 8, 2023
Doctoral Consortium Date: July 5, 2023
APPLICATION PROCESS
Applications should be submitted via email to krais.consortium at gmail.com<mailto:krais.consortium at gmail.com> with a SINGLE PDF, including (i) a CV (up to two pages including contact information, affiliation, and thesis advisor), (ii) a research statement for a summary of your research accomplishments, current work, and future direction and potential of your work (up to two single-spaced pages with 12-point Times New Roman font), and (iii) a letter of nomination from your faculty advisor.
In addition to the PDF file, it is required to submit a business headshot photo that will be incorporated into a summary document containing participants' names, schools, and emails. This document will be shared with all attendees.



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