[AISWorld] CfP: Book on Smart Manufacturing Innovation and Transformation: Interconnection and Intelligence

[zwluo at eti.hku.hk]

CALL FOR CHAPTER PROPOSALS
Proposal Submission Deadline: Jan 15, 2013
Smart Manufacturing Innovation and Transformation: Interconnection and 
Intelligence
A book edited by Dr. Zongwei Luo (University of Hong Kong, Hong Kong, 
China)


To be published by IGI Global: 
http://www.igi-global.com/requests/details.asp?ID=870

Introduction
Fast advances in information technology (RFID, sensor, Internet of things, 
and the Cloud) have led to a smarter world vision with ubiquitous 
interconnection and intelligence. Smart manufacturing refers to advanced 
manufacturing with wise adoption of information technologies throughout 
end to end product and service life-cycles, capturing manufacturing 
intelligence for wise production and services. Smart manufacturing 
represents a field with intense competition in this century of national 
competitiveness.

Objective of the Book
This book will provide a forum of innovative findings in advanced 
manufacturing research and development. It aims to promote an 
international knowledge exchange community involving multidisciplinary 
participation from researchers, practitioners, and academicians with 
insight addressing issues in real life problems towards smarter 
manufacturing. By disseminating latest developments in smart manufacturing 
innovation and transformation in manufacturing upon current and/or 
emerging technology opportunities and market imperatives, this book covers 
both theoretical perspectives and practical approaches for smart 
manufacturing research and development triggered by ubiquitous 
interconnection and intelligence, enabling manufacturing innovation and 
transformation.

Target audience
This book will provide a forum of innovative findings in advanced 
manufacturing research and development. It aims to promote an 
international knowledge exchange community involving multidisciplinary 
participation from researchers, practitioners, and academicians with 
insight addressing issues in real life problems towards smarter 
manufacturing. The target audience would include multidisciplinary 
participants from society, industry, academia, and government.

Recommended topics include, but are not limited to, the following:

* Business models and mechanism design
* Big data computing and intelligence
* Transparent and service computing
* Social and human centric computing
* Robotics and automation
* SCM/Logistics for advanced manufacturing
* MEMS/Hybrid systems for advanced manufacturing
* E-commerce for advanced manufacturing
* Manufacturing intelligence
* Manufacturing sustainability
* Digital and additive manufacturing
* RFID/Internet of Things and cloud computing
* CAD/CAM/CAE/CAPP
* PLM/ERP/CRM
* Structural health monitoring


Submission Procedure
Researchers and practitioners are invited to submit on or before January 
15, 2013, a 2-3 page chapter proposal clearly explaining the mission and 
concerns of his or her proposed chapter. Authors of accepted proposals 
will be notified by February 15, 2013 about the status of their proposals 
and sent chapter guidelines. Full chapters are expected to be submitted by 
April 15, 2013. All submitted chapters will be reviewed on a double-blind 
review basis. Contributors may also be requested to serve as reviewers for 
this project.


Publisher
This book is scheduled to be published by IGI Global (formerly Idea Group 
Inc.), publisher of the Information Science Reference (formerly Idea Group 
Reference), Medical Information Science Reference, Business Science 
Reference, and Engineering Science Reference imprints. For additional 
information regarding the publisher, please visit www.igi-global.com. This 
book is anticipated to be released in 2014.

Important Dates
January 15, 2013:               Proposal Submission Deadline
February 15, 2013:              Notification of Acceptance
May 15, 2013:           Full Chapter Submission
June 30, 2013:          Review Results Returned
August 15, 2013:                Final Chapter Submission
September 15, 2013:             Final Deadline
 
Inquiries and submissions can be forwarded electronically (Word document) 
or by mail to the Editor: 
Zongwei Luo
E-mail: 
 zwluo at eti.hku.hk
Land mail: 
University of Hong Kong
Level 3, Block A, Cyberport 4, 100 Cyberport Road, Hong Kong
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